Edgewater Wireless Systems Inc. (TSXV: YFI) (OTC: KPIFF), a pioneer in AI-powered Wi-Fi Spectrum Slicing silicon solutions, has announced that a presentation by President and CEO Andrew Skafel at a Silicon Catalyst event in Sunnyvale, California, is now available on the company's website. The presentation outlines Edgewater's patented Spectrum Slicing technology, PrismIQ platform strategy, and roadmap for high-reliability wireless connectivity, targeting the growing demand for predictable performance in dense and interference-heavy environments.
The presentation comes as Edgewater transitions from investor validation to disciplined semiconductor execution, following a strategic investor-led first close and initiation of detailed architecture and design reviews for key elements of its Spectrum Slicing and PrismIQ roadmap. According to the company, this increased visibility around its next-generation Wi-Fi strategy addresses the market's need for more resilient wireless performance, particularly as AI, autonomy, industrial systems, defence, public safety, and mission-critical edge applications place greater demands on wireless links.
"Silicon Catalyst gave Edgewater the opportunity to share our strategy with a highly relevant semiconductor, investor and strategic audience," said Skafel. "The video gives shareholders and potential partners a concise look at what we are building, why Spectrum Slicing matters and how Edgewater is positioning for the market's shift toward more reliable wireless performance."
Edgewater's patented Spectrum Slicing technology enables multiple concurrent channels within a Wi-Fi band, designed to address congestion, interference, and performance challenges in dense wireless environments. The company believes this approach is increasingly relevant as critical systems depend on wireless connectivity that must perform reliably outside the lab. "Wi-Fi has historically been measured by peak speed," added Skafel. "The next shift is about reliability. As more critical systems depend on wireless connectivity, the market needs performance that holds up outside the lab - in complex, congested and interference-heavy environments."
Edgewater's participation in Silicon Catalyst, along with recent visibility at semiconductor-focused forums including Synopsys SNUG Silicon Valley and Microelectronics US, reflects the company's broader engagement across the semiconductor ecosystem. The full presentation and accompanying materials are available on Edgewater's website at https://edgewaterwireless.com/latest-presentation/.
In a related update, Edgewater is proceeding with a second tranche of its previously announced non-brokered private placement of up to 16,666,667 units at a price of $0.06 per unit for gross proceeds of up to $1,000,000, together with a permitted 15% over-allotment of up to an additional 2,500,000 units. Each unit consists of one common share and one common share purchase warrant, with each warrant exercisable at $0.09 per share for two years following closing. The TSX Venture Exchange has granted the company a 30-day extension to complete the offering.
Net proceeds are expected to support semiconductor design, engineering, and product development related to the company's Spectrum Slicing prototype and general working capital. The company may reallocate proceeds depending on the development of its business. Eligible arm's-length finders may receive fees in cash, securities, or a combination thereof, subject to TSXV policies and applicable securities laws.
The company closed an initial tranche on June 29, 2026, issuing 7,155,879 units for gross proceeds of $429,353. Securities issued under the offering are subject to a four-month hold period. Completion of the second tranche remains subject to TSXV acceptance. Additional information is available in the company's news releases dated June 1 and June 29, 2026.
