SUSS MicroTec SE, a leading supplier of semiconductor equipment and process solutions, has announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and its first system, the GT200. The move expands the company's portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and rising semiconductor demand from AI and high-performance computing applications.
The GreenTec Solutions portfolio is centered on a hybrid cleaning approach that combines the proven TurbulenStrip™ and CrustBuster™ technologies from SUSS's Photomask Solutions segment. TurbulenStrip™ uses lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ employs patented in-situ UV technology to break down organic materials directly at the wafer surface. Together, these technologies enable highly efficient residue removal and process stability while reducing chemical consumption and eliminating hazardous acids and organic solvents, addressing the semiconductor industry's growing environmental, social, and governance (ESG) needs.
"GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," said Burkhardt Frick, Chief Executive Officer of SUSS. "By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio."
The GT200 is designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, power device, and CMOS applications. It consolidates photoresist removal, surface activation, and final cleaning in one configurable platform, helping fabs reduce tool fragmentation, simplify process flows, and improve operational efficiency. SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption and de-risk technology transfers. More information about the GT200 is available at https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.
SUSS has outlined a clear roadmap toward high-volume manufacturing (HVM). A dedicated 300 mm HVM platform is planned for 2027, followed by a 200 mm HVM platform in 2028. "Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution," said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. This roadmap provides customers with a clear migration path from evaluation to full-scale production.
The company will showcase its latest developments in wafer-level cleaning at SEMICON West. Those interested can register at https://www.suss.com/en/company/events/semicon-west. For more information about SUSS, visit www.suss.com.
This entry into wafer cleaning positions SUSS to capitalize on the growing demand for advanced semiconductor manufacturing while promoting sustainable practices. The GreenTec Solutions line's focus on reduced chemical consumption and elimination of hazardous substances could set a new standard for eco-friendly wafer processing, benefiting both manufacturers and the environment.
