Colovore Executive to Discuss High-Density Data Center Cooling Challenges at DICE Conference
TL;DR
Colovore's expertise in high-density cooling gives companies an edge by enabling more efficient AI deployments and reducing operational costs.
Colovore's panel at DICE will detail how liquid cooling systems manage 350kW+ per rack to support next-generation GPU infrastructure demands.
Advanced cooling innovations enable sustainable AI growth, reducing energy waste and supporting global technological progress for future generations.
Learn how data centers handle 1000kW racks through liquid cooling at Colovore's DICE panel featuring industry leaders from Google and BP.
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Colovore, a high-density colocation data center provider specializing in AI, HPC, and enterprise workloads, announced that Michael Fulkerson, Vice President of Facilities & Operations, will speak on a featured panel at the DICE Data Center Management, Operations & Cooling-West conference in Santa Clara, California. The conference takes place on October 2, 2025, at the Santa Clara Marriott.
The panel titled "The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure?" will address the escalating technical challenges data center operators face as GPUs approach densities of 1000kW per rack. This exponential increase in power density requires fundamental rethinking of facility design across multiple layers, including heat rejection, cooling efficiency, power delivery, and long-term scalability.
Panelists from leading organizations including Google, BP, Wesco, Equinix, and CoolIT Systems will share insights on how their companies are preparing for these near-term technological realities. The discussion will focus on the innovations necessary to sustain the next wave of digital infrastructure growth as computational demands continue to accelerate.
The implications of this discussion are significant for the entire data center industry and the broader technology ecosystem. As artificial intelligence and high-performance computing workloads become more prevalent, the physical infrastructure supporting these technologies must evolve to handle unprecedented power densities. Traditional air-cooling methods are becoming insufficient for these extreme workloads, necessitating advanced cooling solutions like the liquid-cooling technology Colovore specializes in.
For more information about Colovore's approach to high-density data center solutions, visit https://www.colovore.com. The company's expertise in ultra-dense, liquid-cooled data centers positions it at the forefront of addressing the cooling and power challenges discussed at the DICE conference. This industry dialogue represents a critical step toward developing sustainable infrastructure capable of supporting the continued growth of AI and computational technologies.
Curated from citybiz
